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主要元器件封装图
来源: | 作者:556345 | 发布时间: 2020-04-06 | 2021 次浏览 | 分享到:
元器件种类非常多,元器件每个厂家的封装标识又会有些差异,其实封装还是那个封装,只要你看懂了,就什么都懂了,比如SO-16,其实有些标SOP-16,SOIC-16,他们的封装都是一样的,看封装图一切就明了。

主要元件封装图

BGA
Ball Grid Array

CPGA
Ceramic
Pin
Grid
Array

SBGA

LGA

EBGA 680L

PGA
Plastic
Pin Grid Array

FBGA

LBGA 160L

uBGA
Micro
Ball
Grid
Array

QFP
Quad Flat Package

PBGA 217L
Plastic Ball Grid Array

LQFP

PQFP

SBGA 192L

CLCC

LDCC

TSBGA 680L

LCC

PLCC

TQFP 100L

JLCC

SOT26

SOT363

SOJ


LQFP 100L

SO
Small Outline Package

SSOP

METAL QUAD 100L

HSOP28

TSOP
Thin
Small Outline Package

PQFP 100L

TSSOP or TSOP II
Thin Shrink Outline Package

SOH

LAMINATE TCSP 20L
Chip Scale Package

PCMCIA

SNAPTK

LAMINATE CSP 112L
Chip Scale Package

SNAPTK

SNAPZP

CERQUAD
Ceramic Quad Flat Pack

Flat
Pack

SOT220

LLP 8La

SOT223

SOT223

SO DIMM
Small Outline Dual In-line Memory Module

SOT23

Socket 603
Foster

SOT23

SOT323

SOT25

SOT353

SOT343

SOCKET 370
For intel 370 pin PGA Pentium III & Celeron CPU

SOT523

SOT89

SOCKET 423
For intel 423 pin PGA Pentium 4 CPU

TO252

TO263

TO268

SOCKET 462/SOCKET A
For PGA AMD Athlon & Duron CPU

C-Bend
Lead  

Ceramic
Case

SOCKET 7
For intel Pentium & MMX Pentium CPU

Gull
Wing
Leads  

SC-70 5L

PDIP

SDIP

PSDIP

SOJ 32L

PCDIP

DIP
Dual
Inline Package

SOP EIAJ TYPE II 14L

DIP-tab
Dual Inline Package with Metal Heatsink

FDIP

SSOP 16L
 

 

ZIP
Zig-Zag Inline Package

CNR
Communication and Networking Riser Specification Revision 1.2

SIP
Single Inline Package

SIMM30
Single In-line Memory Module

SOT220

SIMM72
Single In-line Memory Module

FTO220

SIMM72
Single In-line Memory Module

SLOT 1
For intel Pentium II Pentium III & Celeron CPU

SLOT A
For AMD Athlon CPU

PCI 32bit 5V
Peripheral Component Interconnect

PCI 64bit 3.3V
Peripheral Component Interconnect

ITO3p

ITO220

TO18

TO71

TO220

TO72

TO247

TO78

TO264

TO8

TO3

TO92

TO5

TO93

TO52

TO99

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